Bioh Kim has joined Yield Engineering Systems Inc.’s management team as President of YES Korea, a leading process equipment manufacturer for advanced semiconductor packaging, life sciences, and “More-than-Moore” applications. He will be based at YES Korea’s Dongtan office and establish the regional business structure and expand the company’s footprint in Korea.

Bioh is a seasoned executive in the semiconductor and display industries with solid technology, business, and management credentials. Before joining YES, he worked for almost a decade with significant equipment companies, including TEL NEXX (Tokyo Electron US) as Vice President of the ECD business unit and international sales & service, Applied Materials as Managing Director of packaging field technology, and APEVA as General Manager (a subsidiary of Aixtron).

Bioh began his work with Samsung in Korea after graduating from Seoul National University with a BS and MS in Materials Science and Engineering. He subsequently spent 20 years working in the semiconductor sector in the United States before returning to Korea in early 2020.

President of YES, Rezwan Lateef, is excited to have Bioh join their senior management team. Lateef feels that his strong business development track record and knowledge of their client base in current and emerging regions will be significant assets for YES as they continue to build their business in Asia.

The establishment of YES’s new office in Dongtan will be first on Bioh’s to-do list, allowing for a tighter relationship with the company’s long-time significant clients in the Korea region.

According to CEO Rama Alapati, the objective of YES is to be the preferred provider in the markets they serve. Physical proximity allows them to be more responsive to their customers’ needs and better foresee and address their roadmaps as their systems have become increasingly vital to their operations. They have high hopes for YES’s continued global expansion in this new phase.

About Yield Engineering Systems

YES (Yield Engineering Systems, Inc.) is a leading provider of high-tech, cost-effective surface, material, and interface transformation equipment. Vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools are among the company’s products used for precise surface modification and thin-film coating of semiconductor wafers, semiconductors, and MEMS devices biodevices.

For more information on YES, visit

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